The SET FC150 Bonder offers you the latest evolution in bonding technologies: ultrasonic/thermo-sonic, laser welding. Heated bond head (up to 350 ☌) and substrate heating (up to 150 ☌)Īre available to cover today's and tomorrow's demands of heat-requiringĪvailable as a completely automated system to level, align and package components down to 200 µm, the FC150 supports the complete range of bonding applications, including optoelectronics and MCM. Just one module with significant UPH increases for a multitude of Integrated dispense axis enables parallel dispensing and bonding in Next to flux film application via slide fluxer an (optionally) Flexibility - Even the standard module of the 2200 evo die bonders can be very variably equipped. The 2200 evo is easy to learn - just as used for the 2200 platform.ĭata transfer via TCP/IP networks is naturally implemented, and the Despite the wide range of fittings and set-up options, operation of Key specifications - Die handling from 0,17 mm - 50 mm, Placement accuracy of ☑0 µm 3s (cmk = 1,33).Small footprint - 2200 evo only requires 1,4 m2 of (clean room) floor space.Multi-chip module - Flip chip and die attach tasks can be executed in just one module.Machine - UPH can be optionally multiplied. (dispensing and bonding) can be arranged consecutively to a single With the globally unique platform concept up to 4 axis systems
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